Atrenne Integrated Solutions | 800.926.8722 | www.atrenne.com | sales@atrenne.com
DEPLOYING COMMERCIAL ELECTRONICS IN RUGGED ENVIRONMENTS
The Small Form Factor (SFF) Solution 760-92 rugged electronic packaging design enables off-the-shelf Mini-ITX and PCIe commercial electronics CCAs to be deployed in the SWAP and cost-constrained, harsh environments characteristic of ground mobile, naval and airborne applications.
Specs:
- DIMENSIONS: 11.22” L X 9.06” W X 3.43” H
- OPERATING TEMPERATURE: -32°C – 55°C
- STORAGE TEMPERATURE: -40°C – 71°C
- WEIGHT: 13 LBS
- ALTITUDE: ABOVE 50,000 FEET
- SHOCK AND VIBRATION: MIL-STD-810
- COOLING: BASEPLATE CONDUCTION
- INTERNAL: MINI-ITX WITH 3 PCIe SLOTS OR SIMILAR
- EMI: MIL-STD-461E
- POWER: <100W, MIL-STD-704E
Features and Benefits:
- Military & Aerospace Electronics Innovators Award Gold Honoree
- Enables Use of Commercial Mini-ITX Processor in Rugged,
Deployed Applications
- Rated for altitudes in excess of 50,000 feet
- Highly optimized for size, weight, and power (SWAP)
constrained applications
- ESS screening validates ruggedness of production units
