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DEPLOYING COMMERCIAL ELECTRONICS IN RUGGED ENVIRONMENTS

The Small Form Factor (SFF) Solution 760-92 rugged electronic packaging design enables off-the-shelf Mini-ITX and PCIe commercial electronics CCAs to be deployed in the SWAP and cost-constrained, harsh environments characteristic of ground mobile, naval and airborne applications.

Specs:

- DIMENSIONS: 11.22” L X 9.06” W X 3.43” H

- OPERATING TEMPERATURE: -32°C – 55°C

- STORAGE TEMPERATURE: -40°C – 71°C

- WEIGHT: 13 LBS

- ALTITUDE: ABOVE 50,000 FEET

- SHOCK AND VIBRATION: MIL-STD-810

- COOLING: BASEPLATE CONDUCTION

- INTERNAL: MINI-ITX WITH 3 PCIe SLOTS OR SIMILAR

- EMI: MIL-STD-461E

- POWER: <100W, MIL-STD-704E

Features and Benefits:

- Military & Aerospace Electronics Innovators Award Gold Honoree

- Enables Use of Commercial Mini-ITX Processor in Rugged,

   Deployed Applications

- Rated for altitudes in excess of 50,000 feet

- Highly optimized for size, weight, and power (SWAP)

   constrained applications

- ESS screening validates ruggedness of production units

Deploying Commercial Electronics at High Altitude White Paper  

SFF Solution 760-72 product page